COM HPC

About COM HPC

High-Performance COM-HPC Modules for Edge Architecture Portwell engineers these modules for next-generation, server-class embedded systems. Specifically, they utilize a dual-board concept similar to COM Express. However, this open PICMG® specification increases connectors from 440 to 800 pins. As a result, developers can support extensive expansions and significantly improve I/O interface speeds. Furthermore, these platforms easily handle PCIe Gen 4 and Gen 5, USB4, and 25G KR signals. This High-Performance COM standard defines two specialized types: Server Type: Delivers superior computing and network throughput. Client Type: Supports high-speed I/O for graphics-rich applications. Advanced Computing and High-Spe ed Connectivity Portwell offers COM-HPC solutions with support for advanced CPUs. Therefore, models can handle processors with a TDP up to 150W. In addition, the server modules provide up to 65 PCIe and 8 KR Ethernet lanes. Moreover, the modular design ensures maximum scalability for mission-critical applications. Applications for Server-Class Computing Our COM-HPC platfo rms ensure maximum performance for demanding environments. Consequently, they are ideal for edge servers, 5G infrastructur e, and AI proc essing. Ulti mately, they deliver reliable, server-class computing for any high-end embedded application.